Brand Name: | ZMSH |
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Model Number: | Wafer Bonding Equipment |
Certification: | rohs |
Place of Origin: | CHINA |
Minimum Order: | 2 |
Price: | by case |
Payment Terms: | T/T |
Delivery Time: | 5-10months |
Bonding Methods: | Room Temperature Bonding |
Compatible Wafer Sizes: | ≤12 Inch, Compatible With Irregular Shaped Samples |
Compatible Materials: | Sapphire, InP, SiC, GaAs, GaN, Diamond, Glass, Etc |
Max Pressure Of Press System: | 100 KN |
Alignment Method & Precision: | Edge alignment accuracy: ≤±50 μm; Mark alignment accuracy: ≤±2 μm |
Bonding Strength: | ≥2.0 J/m² @ room temperature (for Si-Si direct bonding) |
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