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Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch

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Product Details
Brand Name: ZMSH
Model Number: Wafer Bonding Equipment
Certification: rohs
Place of Origin: CHINA
Minimum Order: 2
Price: by case
Payment Terms: T/T
Delivery Time: 5-10months
Bonding Methods: Room Temperature Bonding
Compatible Wafer Sizes: ≤12 Inch, Compatible With Irregular Shaped Samples
Compatible Materials: Sapphire, InP, SiC, GaAs, GaN, Diamond, Glass, Etc
Max Pressure Of Press System: 100 KN
Alignment Method & Precision: Edge alignment accuracy: ≤±50 μm; Mark alignment accuracy: ≤±2 μm
Bonding Strength: ≥2.0 J/m² @ room temperature (for Si-Si direct bonding)
Description
Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding ...

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